With homeland security on high alert, screening systems to search for concealed weapons are crucial pieces of equipment. But these systems are often prohibitively expensive, putting them out of reach for public spaces such ...
Electronics & Semiconductors
Sep 12, 2012
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(Phys.org) -- Increasing the areal density at which electronic components can be integrated onto a computer chip has always been key to the revolution of technological applications. However, achieving the same feat in the ...
Optics & Photonics
Jul 4, 2012
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Researchers in Ireland have developed a new technology using materials called bulk metallic glasses to produce high-precision molds for making tiny plastic components. The components, with detailed microscopically patterned ...
Materials Science
May 22, 2012
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Magnetic storage media such as hard drives have revolutionized the handling of information: We are used to dealing with huge quantities of magnetically stored data while relying on highly sensitive electronic components. ...
Nanomaterials
Jun 20, 2011
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(PhysOrg.com) -- In the future, physicists will be able to follow a new lead in their search for new materials for electronic components, for example. An international team of researchers headed by scientists at the Max Planck ...
Condensed Matter
May 26, 2011
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University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.
Electronics & Semiconductors
Jul 15, 2010
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(PhysOrg.com) -- With the help of neural networks, in which complex algorithms are used to monitor critical process steps, engineers are paving the way for zero-defect production in the area of metal powder injection molding. ...
Engineering
Apr 2, 2010
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(PhysOrg.com) -- When metals are shaped, the materials they are made of are often damaged in the process. One cause of this is excessive press force, which cracks and perforates the material. By running simulations on a PC, ...
Engineering
Feb 1, 2010
0
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Up to now, extreme production temperatures made it impossible to equip metallic components with RFID chips during the operating process. At Euromold in Frankfurt (Dec. 2-5), Germany, Fraunhofer researchers present a variation ...
Engineering
Nov 24, 2009
3
0
Producing metallic hollow spheres is complicated: It has not yet been possible to make the small sizes required for new high-tech applications. Now for the first time researchers have manufactured ground hollow spheres measuring ...
Materials Science
Oct 13, 2009
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