Page 3 - News tagged with packaging technology

NEC Develops a Three-Dimensional Chip-Stacked Flexible Memory

NEC Corporation announced today the development of chip-stacked flexible memory, which can be used to achieve a new system-on-chip (SoC) architecture. The new SoC's architecture consists of separate logic (excluding embedded ...

Electronics & Semiconductors

Feb 10, 2009

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Unprecedented growth seen for solar energy

The head of the federal government's effort to promote solar technology told about 200 industry leaders yesterday that expanding the industry to the level needed by 2030 will require unprecedented levels of growth.

Energy & Green Tech

Feb 6, 2009

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