Device bonds metal and plastic within seconds

Scientists at the Fraunhofer Institute for Material and Beam Technology IWS in Dresden have developed a joining gun that creates a connection between metal and thermoplastic materials within seconds. This gun is of a modular ...

Qualcomm settles vastly reduced Taiwan antitrust fine

US chipmaking giant Qualcomm on Friday agreed a sharply reduced fine with Taiwan after officials said it had harmed market competition and manipulated prices, as it faces a number of probes worldwide.

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